1. Ho ikarabella bakeng sa ho ngola le ho sekaseka software le ho rarolla li-module tse nyane tsa k'hamphani kapa lisebelisoa tsa liteko;

2. Ho ikarabella bakeng sa nts'etsopele le ho lokisa liphoso tsa software ea mantlha ea merero e mecha ea k'hamphani;

3. Tlhokomelo ea software ea motheo ea projeke ea khale;

4. Ruta setsebi sa theknoloji kapa mothusi;

5. Ho ikarabella bakeng sa mesebetsi e meng ea litokisetso tsa boetapele;

1. Bokgoni ba ho sebedisa puo ya C, ho sebedisa STC, PIC, STM32 le di-microcontroller tse ding ho rala diporojeke tse fetang tse pedi tsa dihlahiswa;

2. Tsebo ea ho sebelisa puisano ea serial, SPI, IIC, AD le tse ling tsa mantlha tsa puisano ea kantle ho naha;

3. Bokhoni ba ho iketsetsa dihlahiswa ho ya ka ditlhoko tsa sehlahiswa;

4. Ka tsebo ea potoloho ea analoge ea dijithale, re ka utloisisa moralo oa potoloho;

5. Ho ba le bokgoni bo botle ba ho bala dingolwa tsa Senyesemane;